![Semiconductor device fabrication / Integrated circuits / Electronic engineering / Electronics / Electromagnetism / Packaging / Three-dimensional integrated circuit / Through-silicon via / Fraunhofer Society / Wafer backgrinding / Wafer Semiconductor device fabrication / Integrated circuits / Electronic engineering / Electronics / Electromagnetism / Packaging / Three-dimensional integrated circuit / Through-silicon via / Fraunhofer Society / Wafer backgrinding / Wafer](https://www.pdfsearch.io/img/8d7a0d485c72175ec4d1853c35735264.jpg) Date: 2016-05-25 07:28:49Semiconductor device fabrication Integrated circuits Electronic engineering Electronics Electromagnetism Packaging Three-dimensional integrated circuit Through-silicon via Fraunhofer Society Wafer backgrinding Wafer | | F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden YEARSAdd to Reading ListSource URL: www.izm.fraunhofer.deDownload Document from Source Website File Size: 1,54 MBShare Document on Facebook
|