1![F R A U N H O F E R re s ear c h I n s t i t u t ion for M i c ro s y s t em s an d So l i d S tat e Te c hno l o g ie s E M F T 2 1 F R A U N H O F E R re s ear c h I n s t i t u t ion for M i c ro s y s t em s an d So l i d S tat e Te c hno l o g ie s E M F T 2 1](https://www.pdfsearch.io/img/b47085f2e1a8d97faa7d432170901bfc.jpg) | Add to Reading ListSource URL: www.emft.fraunhofer.deLanguage: English - Date: 2015-11-12 01:37:49
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2![F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden YEARS F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden YEARS](https://www.pdfsearch.io/img/8d7a0d485c72175ec4d1853c35735264.jpg) | Add to Reading ListSource URL: www.izm.fraunhofer.deLanguage: English - Date: 2016-05-25 07:28:49
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3![Low-Cost 3D Chip Stacking with ThruChip Wireless Connections [removed] [removed] [removed] Low-Cost 3D Chip Stacking with ThruChip Wireless Connections [removed] [removed] [removed]](https://www.pdfsearch.io/img/2abb0a3927297417672d38c1931dda0d.jpg) | Add to Reading ListSource URL: www.hotchips.orgLanguage: English - Date: 2014-08-04 13:35:25
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4![3D IC integration and ESD: “Not the ESD you grew up with!” Stephen Fairbanks Managing Director 3D IC integration and ESD: “Not the ESD you grew up with!” Stephen Fairbanks Managing Director](https://www.pdfsearch.io/img/92276a08090e36d1e823c4aefcd870dc.jpg) | Add to Reading ListSource URL: www.gsaglobal.orgLanguage: English - Date: 2014-01-22 10:41:25
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5![j431 Index a acoustic microscopy 406, 407 – bonded wafer thickness, measuring 417 j431 Index a acoustic microscopy 406, 407 – bonded wafer thickness, measuring 417](https://www.pdfsearch.io/img/c58deb9ca9649f9bc8d263cb8fef4cf0.jpg) | Add to Reading ListSource URL: www.wiley-vch.deLanguage: English - Date: 2014-03-31 21:03:45
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6![Ziptronix and Customer Pursue Lower-Cost 3D Memory With DBI® Wafer Bonding and Interconnect Technology Ability to Replace Die Stacking with High-strength Wafer Stacking Simplifies Process Flows, Increases Interconnect D Ziptronix and Customer Pursue Lower-Cost 3D Memory With DBI® Wafer Bonding and Interconnect Technology Ability to Replace Die Stacking with High-strength Wafer Stacking Simplifies Process Flows, Increases Interconnect D](https://www.pdfsearch.io/img/61cc3ab6cee86a33a718ccd093fb850e.jpg) | Add to Reading ListSource URL: www.ziptronix.comLanguage: English - Date: 2012-12-12 11:53:15
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