San Francisco / Piscataway / Rappaport / Guilin / Oxford / Hsinchu / Chili / Vienna / Hiroshima / Washington / DC / Chicago / Williamsburg / Dallas / Menlo Park / New York / Beijing / /
Company
Electronics Engineers Inc. / SanDisk / IEEE International Interconnect Technology / IITC Harold Hosack Semiconductor Research Corporation / Packaging Sciences / Parrillo Consulting / USA Calvin Hsueh Taiwan Semiconductor Manufacturing Co. / Samsung / Semiconductor Research Corporation / EDS / Chapter Partners / IITC Short Course / IBM / Eastman Kodak Co. / Hitachi / SRI International / Toshiba / Interconnect Systems / The Dow Chemical Co. / Page 10 / Nanotechnology Council / Jr. Past / /
Continent
Africa / Asia / Europe / North America / /
Country
Brazil / Moldova / United Kingdom / China / Argentina / Peru / Japan / Canada / India / Taiwan / Belarus / Bangladesh / Belgium / Turkey / Austria / United States / Singapore / /
Currency
USD / / /
Event
M&A / Product Issues / Person Travel / /
Facility
Hong Kong University of Science / Publications Renuka P. Jindal University of Louisiana / Andrzej Napieralski Technical University of Lodz E-Mail / University E-Mail / Membership Albert Z. H. Wang Illinois Institute of Technology E-Mail / Chicago Mart Plaza Hotel / Jacobus W. Swart State University of Campinas E-mail / Georgia Institute of Technology / Northeast Asia Kazuo Tsutsui Tokyo Institute of Technology E-mail / Conference Co-Chairs Institute / San Francisco Hilton Hotel / San Francisco Hilton John K. Lowell Hotel / Stojadinovic University of Nis E-Mail / Peking University / Schönbrunn Palace / National Chung Tung University / Northwestern University / Newcastle University / San Francisco Airport Hyatt Regency Hotel / Educational Activities Paul K. L. Yu University of California / Chicago Art Institute / O’Hare Airport / East Asia Hei Wong City University of Hong Kong E-Mail / z.hu@manchester.ac.uk Western Europe Cora Salm University of Twente E-Mail / Holiday Inn Chicago Mart Plaza Hotel / Nanyang Technological University / Institute of Electrical / Africa Zhirun Hu University of Manchester E-mail / University of Central Florida / Stanford Research Institute / Institute of Technology E-mail / Regions/ Chapters Juin J. Liou University of Central / Illinois Institute of Technology / / /
IndustryTerm
performance computing / metal-dielectric systems / technology advances / chip-on-chip / large area field emission devices / flip-chip / vacuum micro-and nanoelectronic devices / by-law changes / indirect infrastructure / conference web site / metal/dielectric deposition / bioelectronic and biomedical applications / electronics / technology topics / nano-scale devices / optoelectronic systems / optoelectronics devices / process technologies / word device / integrated circuit technology / metal silicide/salicides / public transportation / technology professionals / terahertz devices / metal / web / compact devices / deposition processes/equipment / molecular devices / online educational modules / potential solutions / research devices / memory processing / dense network / on-chip networks / metal barrier / /
NaturalFeature
Chicago River / /
Organization
Technical Committee / Newcastle University / Northern Illinois University / Illinois Institute of Technology / Technology Management Council / Peking University / Naval Research Lab in Washington / Intelligent Transportation Systems Society / Ninoslav D. Stojadinovic University of Nis E-Mail / TAB Periodicals Committee / United Nations Educational Scientific and Cultural Organization / Institute of Electrical / EDS Chapter of the Year / McMaster University / IEEE Electron Devices Society / Northwestern University / Stanford Research Institute / Hong Kong University of Science and Technology / National Chung Tung University / z.hu@manchester.ac.uk Western Europe Cora Salm University of Twente E-Mail / University of California at San Diego / Nominations and Elections Committee / Institute for Nanotechnology / GOLD / Africa Zhirun Hu University of Manchester E-mail / EDS Fellows and AdCom / University of Central Florida / IEEE Product Safety Engineering Society / IEEE Technical Activities Board / Tokyo Institute of Technology / East Asia Hei Wong City University of Hong Kong E-Mail / Publications Renuka P. Jindal University of Louisiana / EDS Distinguished Service / Institute of Technology E-mail / Membership Albert Z. H. Wang Illinois Institute of Technology E-Mail / Meetings Committee / IEEE Board / Imperial Court / Duke University / Novosibirsk State Technical University / IEEE Educational Activities Board / Andrzej Napieralski Technical University of Lodz E-Mail / Univ. of Louisiana-Lafayette / Nanotechnology Council / Electron Devices Society / Defense Advanced Research Project Agency / Jacobus W. Swart State University of Campinas E-mail / Institute of Electrical and Electronics Engineers / IEEE Nanotechnology Council / NEWSLETTER EDITORIAL STAFF ELECTRON DEVICES SOCIETY President Ilesanmi Adesida University of Illinois E-mail / IEEE Engineering Management Society / IEEE TMC / Administrative Committee / AdCom / IEEE Technology Management Council / Penn State Univ. / Conference Co-Chairs Institute for Microelectronics TU Wien / Executive Office / Georgia Institute of Technology / Chicago Art Institute / Nanyang Technological University / Regions/ Chapters Juin J. Liou University / Stanford / /
Person
Steve Parke / James Meindl / Bill Van Der Vort Cor Claeys / Al MacRae / Lou Parrillo / Mark Law / Ade Adesida / Doug Verret / Cary Yang / Martin Wagner / Kim / Phillip Wong / Diane Freeman / Thomas N. Jackson / Yuan Taur / Charles (Capp) Spindt / Harold Hosack / Ron Waynant / Xing Zhou / Jie Sun / S. Philip Wong / Albert H. Wang / John K. Lowell / Jack Yuan / Jon Candelaria / Paul Yu / Shelby Nelson / Mark Lundstrom (Purdue) / Hideo Sunami / Dennis Polla / Bill Van Der Vort Cor / Peter Griffin / Philip Wong / Heinz H. Busta / Albert Wang / Frederick Phillips / Juin Liou / Chi Yung Ng / Siegfried Selberherr / Wen Wu / Wendy Walker / Alam (Purdue) Susumu Namba / Bill Van Der Vort / Chad Mirkin / James Plummer / Mark Lundstrom / Steve Chung / S. Chung R. Huang / Ravi Todi / Cor Claeys / R. Huang R. P. Jindal / Ken Shoulders / Stephen A. Parke / Bob Doering / Raymond Woo / Hiroshi Iwai / Samar Saha / Steve Hillenius / Toshiro Hiramoto / Ilesanmi / Charles Hunt / Leda Lunardi / Sanchez J.B. Kuo / Robert Adler / Muhammed Alam (Purdue) Susumu / Henry Gray / Kiyo Tomiasu / Joyce Lombardini / Xing Zhou Nanyang / Stephen A. Parke Tennessee / William F. Van Der Vort / Alfred U. Mac Rae Mac / Ibrahim M. Abdel-Motaleb / Paul DeSesso / / /
Position
Executive Director / Graduate Student Fellowship Chair / w.vandervort@ieee.org Business Coordinator / Secretary / Professor / Treasurer / Optoelectronics TC Chair / young scientist / Technical Chair / Consultant / VLSI Technology Chair / Editor-in-Chief / leader / TC Chair / General Co-Chair and Director / ieee@ref.nstu.ru Executive Director / President / awang@ece.iit.edu Treasurer / Fellows Chair / Administrator / Vice-President Reports Regions/Chapters V-P / VP / Vice-President / Vice-President of Awards / appropriate Editor / Director / Chair / Distinguished Lecturer / /
Product
metal / /
ProvinceOrState
Louisiana / New Mexico / California / Colorado / New Jersey / Illinois / Virginia / New York / T / /
PublishedMedium
the Nanotechnology Magazine / the Circuits and Devices Magazine / D Magazine / the Journal of Applied Physics / /
Region
South Western USA / Western Europe / Central USA / Scandinavia / Northeast Asia / East Asia / Latin America / South Asia / Eastern Europe / Asia Pacific / Southeastern USA / Middle East / Western USA / Central Europe / Northern Illinois / Central Florida / /
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