| Document Date: 2014-09-30 21:12:39
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City Berlin / / Company FormFactor Inc. / Qualcomm / Sensata Technologies / Sr. Staff / / Country Germany / / / Facility Maintaining stable / / / IndustryTerm flip-chips / nex-gen solutions / integrated applications / metal-to-metal contact areas / solder bump technology / smart devices / 3D design tools / quality management / interconnection solutions / metal-to-metal contact / interconnect technology / physical metal-to-metal contact area differences / thermal analysis manufacturing / consumer devices / pillar technology / value interconnection solutions / pillar flip-chip / / Person Steve Bezuk / mark d / William Miller / Sr / Lily Zhao / Amer Cassier / Ahmer Syed / Mike Slessor / Amy Leong / Steve Bez / / / Position archer / President / Manager / mechanically formed probe head / Engineer / Director / / ProvinceOrState Minnesota / British Columbia / Mississippi / Colorado / / Technology Cu pillar flip-chip / smart phones / 26 Chip / photolithography / mobile devices / MEMS / 1306 Chip / 24 Chip / interconnect technology / probe cards / Cu pillar technology / solder bump technology / 3g / 777 Chip / / URL www.qinex.com / www.atotech.com / /
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Reliable testing of Cu pillar technology for smart devices By Amer Cassier, Lily Zhao, Ahmer Syed, Steve Bezuk, William Miller [Qualcomm] and Amy Leong, Mike Slessor [FormFactor Inc.] T