Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force Jianbiao Pan1, Brian J. Toleno2, Tzu-Chien Chou1, Wesley J. Dee1, 1 California Polytechnic State University, San Luis Obispo, CA[removed]Henkel Technol

First Page		Document Content
Date: 2012-05-29 19:17:04 Electromagnetism Solder Reflow soldering Wave soldering Surface-mount technology Flux HASL Restriction of Hazardous Substances Directive Printed circuit board Electronics manufacturing Electronics Manufacturing		Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force Jianbiao Pan1, Brian J. Toleno2, Tzu-Chien Chou1, Wesley J. Dee1, 1 California Polytechnic State University, San Luis Obispo, CA[removed]Henkel Technol Add to Reading List Source URL: www.hellerindustries.com Download Document from Source Website File Size: 3,46 MB Share Document on Facebook

	1 ELLEN MACARTHUR FOUNDATION • CIRCULAR CONSUMER ELECTRONICS: AN INITIAL EXPLORATION CIRCULAR CONSUMER DocID: 1xVXt - View Document
	IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, VOL. 64, NO. 12, DECEMBERAdaSharing: Adaptive Data Sharing in Collaborative Robots DocID: 1xVjO - View Document
	IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, VOL. 64, NO. 8, AUGUSTReliability and Temporality Optimization for Multiple Coexisting WirelessHART Networks DocID: 1xUDa - View Document
	Reverse Logistics for Consumer Electronics: Forecasting Failures, Managing Inventory, and Matching Warranties by Andre du Pin Calmon Submitted to the Sloan School of Management DocID: 1xTwd - View Document
	PDF Document DocID: 1xRlh - View Document