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Electromagnetism / Solder / Reflow soldering / Wave soldering / Surface-mount technology / Flux / HASL / Restriction of Hazardous Substances Directive / Printed circuit board / Electronics manufacturing / Electronics / Manufacturing


Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force Jianbiao Pan1, Brian J. Toleno2, Tzu-Chien Chou1, Wesley J. Dee1, 1 California Polytechnic State University, San Luis Obispo, CA[removed]Henkel Technol
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Document Date: 2012-05-29 19:17:04

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File Size: 3,46 MB

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Irvine / Lake Buena Vista / Bath / Chicago / /

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Flextronics International / Japan Electronics / Henkel Technologies / Parameters Settings Range 20 Kg / DEK / Solectron Corp. / Environmentally Aware Manufacturing / Inter-National Electronics Manufacturing / Interactions AB / Heller Industries / Siemens / /

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Europe / /

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United States / /

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Square Root / California Polytechnic State University / /

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solder paste printing process / printing / green product / electronic product / stencil printing / electronics industry / printing quality / energy dispersive spectroscopy / /

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Microsoft Vista / /

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office of Naval Research / Japan Electronics and Information Technology Industries Association / Information Technology Industries Association / Colorado School of Mines / Shear Force / California Polytechnic State University / San Luis Obispo / IMC / European Union / Shear Force of SnPb Solder Joints / Navy / /

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Dennis Willie / Kim Hyland / Roger Jay / Charlson Bernal / Buena Vista / /

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php / /

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Florida / California / /

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laser / Information Technology / spectroscopy / /

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