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Electronics / Electronic design / Electrical safety / Application-specific integrated circuit / Substrate coupling / IMEC / Integrated circuit design / Melexis / Semiconductor device fabrication / Electromagnetism / Electronic engineering / Integrated circuits


T102-medea+ (lo1[removed]:37
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Document Date: 2009-03-25 10:36:48

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City

Zurich / Osnabrück / Vienna / /

Company

ATMEL / Alcatel Microelectronics Atmel Germany / Infineon Technologies / Cadence Design Systems / Europe Partners / Philips / STMicroelectronics / ESPRIT / APPLICATIONS Partners / /

Continent

Europe / /

Country

Germany / United States / /

Currency

EUR / /

/

Facility

Vienna University of Technology Integrated Systems Laboratory / University of Bochum Fraunhofer Institute / University of Hanover Institute / University of Osnabrück IMEC IMMS Infineon Technologies Institute / Institute of Technology / /

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IndustryTerm

silicon processing design / multi-chip solution / micron hand-held systems / automotive electronics / software tools / Problems devices / electrostatic gle chip / /

Organization

Information Society / University of Osnabrück IMEC IMMS Infineon Technologies Institute for Microelectronic Systems / ASIC / MEDEA+ Office / University of Bochum Fraunhofer Institute for Reliability and Microintegration Fachhochschule / Institute of Technology / European Commission / Vienna University of Technology Integrated Systems Laboratory / University of Hanover Institute for Solid State Electronics / /

Person

Wolfgang Wilkening / Robert Bosch / /

/

Position

X-FAB Project leader / leader / co-operative / /

PublishedMedium

the Information Society / /

Technology

semiconductor / one chip / electrostatic gle chip / ASIC / simulation / /

URL

http /

SocialTag