ORIGINAL ARTICLE Solder joints in surface mounted IC assemblies: Relief in stress and warpage owing to the application of elevated stand-off heights E. Suhir1,2 E. Suhir. Solder joints in surface mounted IC assemblies:

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Date: 2018-03-05 01:37:17		ORIGINAL ARTICLE Solder joints in surface mounted IC assemblies: Relief in stress and warpage owing to the application of elevated stand-off heights E. Suhir1,2 E. Suhir. Solder joints in surface mounted IC assemblies: Add to Reading List Source URL: www.pulsus.com Download Document from Source Website File Size: 830,74 KB Share Document on Facebook