![](https://www.pdfsearch.io/img/8baa3a80a2b64922c8333afc6cb5176b.jpg) Date: 2018-03-05 01:37:17
| | ORIGINAL ARTICLE Solder joints in surface mounted IC assemblies: Relief in stress and warpage owing to the application of elevated stand-off heights E. Suhir1,2 E. Suhir. Solder joints in surface mounted IC assemblies: Add to Reading ListSource URL: www.pulsus.comDownload Document from Source Website File Size: 830,74 KBShare Document on Facebook
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