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ORIGINAL ARTICLE Solder joints in surface mounted IC assemblies: Relief in stress and warpage owing to the application of elevated stand-off heights E. Suhir1,2 E. Suhir. Solder joints in surface mounted IC assemblies:
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Document Date: 2018-03-05 01:37:17
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ORIGINAL ARTICLE Solder joints in surface mounted IC assemblies: Relief in stress and warpage owing to the application of elevated stand-off heights E. Suhir1,2 E. Suhir. Solder joints in surface mounted IC assemblies: