UTAC Reflow Analysis Capability Thermal-Mechanical Simulation for Reflow Analysis Industry - Thermal profiling - Document - PDFSEARCH.IO

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	UTAC Reflow Analysis Capability Thermal-Mechanical Simulation for Reflow Analysis Industry Add to Reading List Document Date: 2012-10-10 04:07:58 Open Document File Size: 492,50 KB Share Result on Facebook Company ANSYS Inc / IT (Asia) Pte Ltd. / / IndustryTerm software capabilities / / Technology heat transfer / flip chip / Simulation / CAD / / URL www.cadit.com.sg / www.ansys.com / / SocialTag Manufacturing Reflow soldering Reflow oven Ansys Flip chip Reliability Thermal profiling Electronics manufacturing Electronic engineering Electronics

UTAC Reflow Analysis Capability Thermal-Mechanical Simulation for Reflow Analysis IndustryAdd to Reading List