![Integrated circuits / Microtechnology / Three-dimensional integrated circuit / Ball grid array / Quad-flat no-leads package / Chip scale package / Interposer / Amkor Technology / Flip chip / Semiconductor device fabrication / Electronics / Electronic engineering Integrated circuits / Microtechnology / Three-dimensional integrated circuit / Ball grid array / Quad-flat no-leads package / Chip scale package / Interposer / Amkor Technology / Flip chip / Semiconductor device fabrication / Electronics / Electronic engineering](https://www.pdfsearch.io/img/4a1b677f5bb5770f5bae945915b83abe.jpg)
| Document Date: 2013-07-28 00:29:56 Open Document File Size: 3,29 MBShare Result on Facebook
Company Amkor / / Facility TSV Key Process Foundry / Stacking Tutorial Choon Lee Technology HQ / / Organization PoP TMV Hybrid TSV / / Person Ni / / Product Ultra book Tablet / / PublishedMedium The Guardian / / Technology Choon 3D Packaging Paradigm Shift Package Stacking 3D Stacking 3D IC Package-on-Package Flip chip / CVD / MEMS / Choon PC Technology / Mobile Phone Technology / Smartphones / Smartphone / CMP / / URL www.ifixit.com / /
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