Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication

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Date: 2016-07-20 11:09:32 Electronics manufacturing Packaging Microtechnology Semiconductor device fabrication Wafer bonding SUSS MicroTec Wafer Microelectromechanical systems Acoustic microscopy Silicon on insulator Eutectic bonding Capacitive micromachined ultrasonic transducers		Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication Add to Reading List Source URL: www.sonoscan.com Download Document from Source Website File Size: 1,47 MB Share Document on Facebook

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	Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication DocID: 1oWR7 - View Document
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