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Microsoft Word - Ziptronix_EVG_PR_FINAL.docx
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Document Date: 2014-05-28 10:11:14

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File Size: 103,72 KB

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City

Lake Buena Vista / /

Company

Ziptronix Inc. / EV Group (EVG) EV Group / EV Group / /

Country

United States / /

Currency

AMD / /

Event

Business Partnership / /

IndustryTerm

process solutions / placement tool / highperformance 3D memory products / semiconductor applications / volume manufacturing / metrology equipment / 3D technologies / low-temperature direct bond technology / power devices / inspection systems / elaborate network / manufacturable and lowest total cost-of-ownership solutions / conductor/dielectric bonding technology / metal/oxide / microelectromechanical systems / fusion bonding equipment / stacked systems-on-chip / high-volume manufacturing / metal bonding / nanotechnology devices / thin-wafer processing / 3D applications / manufacturing approaches / equipment / /

OperatingSystem

Microsoft Vista / /

Person

Paul Lindner / Paul Enquist / Hybrid Bonding / /

Position

CTO and VP Engineering / conductor / Executive Technology Director / /

Product

SmartView / /

ProvinceOrState

Florida / North Carolina / /

Technology

semiconductor / conductor/dielectric bonding technology / microelectromechanical systems / MEMS / semiconductors / 3D technologies / Hybrid Bonding technologies / stacked systems-on-chip / dielectric / low-temperature direct bond technology / lithography / Hybrid Bonding technology / DBI Hybrid Bonding technology / integrated circuits / /

URL

www.ziptronix.com / www.EVGroup.com / /

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