Back to Results
First PageMeta Content
Technology / Electronics / Electronics manufacturing / Wafer bonding / Adhesive bonding / Fraunhofer Society / Laboratories / Materials science


C o n tact V i s it u s at t h e I n n o T r a n s i n B e r li n : Hall 2 3 b , B o o t h 2 0 6
Add to Reading List

Document Date: 2014-12-05 21:11:14


Open Document

File Size: 2,11 MB

Share Result on Facebook

City

Berlin / Lisbon / /

/

Facility

Fraunhofer Research Fraunhofer Institute / Fraunhofer Institute Fraunhofer Institute / Fraunhofer Institute / /

IndustryTerm

plastic technology / train control systems / development chain / energy self-sufficient sensors / energy harvesting / adhesive bonding technology / /

Organization

Institution for Physical Measurement Polymeric Materials / Center for Adhesive Bonding Technology / Fraunhofer Research Fraunhofer Institute / Plastics Competence Center / Federal Railway Authority / Fraunhofer Institute Fraunhofer Institute / Fraunhofer Institute / /

Person

Alexander Reiterer / Lutz Hartmann / Jens Gerlach Wolfgang Kappes / Franziska Kowalewski / /

/

Technology

adhesive bonding technology / ultrasound / /

URL

www.izfp.fraunhofer.de / www.fokus.fraunhofer.de / www.lbf.fraunhofer.de / www.verkehr.fraunhofer.de / www.ipm.fraunhofer.de / www.fraunhofer.de / www.ifam.fraunhofer.de / www.pyco.fraunhofer.de / /

SocialTag