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F R A U N H O F E R I N S T I T U T E F O R M E C H A N I C S O F M AT E R I A L S I W M COMPONENTS IN MICROELECTRONICS AND MICROSYSTEMS TECHNOLOGY Your competent partner for
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Document Date: 2011-11-18 03:55:18


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Company

UPS / Infineon Technologies AG / AES / /

Continent

Europe / /

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Event

Product Issues / /

Facility

Institute Management Prof. Dr. Peter Gumbsch Prof. Dr. Ralf B. Wehrspohn Fraunhofer IWM / /

IndustryTerm

simulation tools / surface technologies / automotive electronic applications / ultra-thin semiconductor chips / microelectronic systems / power devices / semiconductor devices / microsystems technology / manufacturing yield / pad applications / automotive electronics market / changes processing / thick film technologies / manufacturing processes / energy / department microsystems technology / metal / aircraft technologies / strength properties technologies / ceramic tools / preparation tools / semiconductor technologies / chemical decap / ultra-precision manufacturing / involved materials new preparation tools / scientific networks / electronics / polymer electronics / correlation systems / gas sensors / manufacturing quality / competencies products / manufacturing / main packaging technology / technology qualification / diagnostics chemical contamination / wafer-bonding technologies devices / microsystem technologies / optimizing specific scientific networks / /

Organization

Fraunhofer Institute / INSTITUTE FOR MECHANICS OF MATERIALS IWM Business Unit Components / /

Person

Ralf B. Wehrspohn Fraunhofer / /

/

Position

Head of department microsystems technology Group / department microsystems technology Group leader / model development using multi-scale capability / /

Product

electronic behavi / /

Technology

semiconductor / ultra-thin semiconductor chips / main packaging technology / microsystems technology / IC technologies / X-ray / tomography / semiconductor devices / strength properties technologies / thermography / surface technologies / integrated circuits / aircraft technologies / thick film technologies / CMP / cellular telephone / laser / MEMS / department microsystems technology / semiconductor technologies / microsystem technologies / optoelectronics / spectroscopy / simulation / flash / /

URL

WWW.EN.IWM.FRAUNHOFER.DE / www.en.iwm.fraunhofer.de/business-units/components-in-microelectronics-and-microsystems-technology / /

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