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Semiconductor device fabrication / Electronics manufacturing / Printmaking / Wafer / Microelectromechanical systems / Screen printing / Solder paste / Three-dimensional integrated circuit / Stencil / Microtechnology / Technology / Electronics


SCREEN PRINTING FOR MEMS PACKAGING AND WAFER BONDING Contact
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Document Date: 2015-01-15 11:24:45

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Company

Cognex / /

Country

Germany / /

/

Facility

SCREEN PRINTING FOR MEMS PACKAGING AND WAFER BONDING Contact Description Fraunhofer Institute / /

IndustryTerm

screen printing / material transfer technology screen / trace stencil printing / printing / screen printing process / repeatable printing / software-based high-precision / precision wafer alignment software / direct printing / /

Organization

PRINTING FOR MEMS PACKAGING AND WAFER BONDING Contact Description Fraunhofer Institute for Electronic As / /

Person

Tobias Seifert / Maik Wiemer / /

/

Product

Stinger / /

Technology

semiconductor / MEMS / /

SocialTag