![Electron microscopy / Failure / Failure analysis / Maintenance / Problem solving / Reliability engineering / Wafer bonding / Electron microscope / Microscopy / Scientific method / Science / Chemistry Electron microscopy / Failure / Failure analysis / Maintenance / Problem solving / Reliability engineering / Wafer bonding / Electron microscope / Microscopy / Scientific method / Science / Chemistry](https://www.pdfsearch.io/img/f54027f8f6cc5f0dc4566139124d08cf.jpg)
| Document Date: 2014-05-19 10:54:40 Open Document File Size: 1,45 MBShare Result on Facebook
City Si / / Company Fraunhofer CAM / / / IndustryTerm electronics packaging / microelectronics systems / technology development / electronics / multi-layer devices / fan 3D devices / throughput site / µm lateral resolution software / semiconductor technologies / microscopy different technologies / technology assessment / microsystem technologies / / Person Frank Altmann / CAM FRAUNHOFER CAM MAJOR / / / Position cross section polisher / / Technology semiconductor / microsystem technologies / Optoelectronics / laser / MEMS / Thermography / semiconductor technologies / X-Ray / simulation / tomography / techniques for fault isolation / site / / URL www.cam.fraunhofer.de / /
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