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Technology / Electronics manufacturing / Chemical bonding / Wafer bonding / Microelectromechanical systems / Deep reactive-ion etching / Wafer / Through-silicon via / EV Group / Semiconductor device fabrication / Materials science / Microtechnology


FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto
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Document Date: 2013-01-18 04:01:57

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City

Berlin / /

/

Facility

Fraunhofer Institute / /

IndustryTerm

metal filling / important key technologies / image sensor systems / carrier oppermann@izm.fraunhofer.de / carrier wafer using gold-thin solder / manufacturing / thin wafer backside processing / /

Organization

European Union / Fraunhofer Institute for Reliability / /

Person

Kai Zoschke / /

/

Technology

important key technologies / MEMS / required technologies / /

URL

www.izm.fraunhofer.de / /

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