![Materials science / Fraunhofer Society / Wafer bonding / Through-silicon via / Wafer / Deep reactive-ion etching / Semiconductor device fabrication / Microtechnology / Electronics Materials science / Fraunhofer Society / Wafer bonding / Through-silicon via / Wafer / Deep reactive-ion etching / Semiconductor device fabrication / Microtechnology / Electronics](https://www.pdfsearch.io/img/8f6bfd8697111ce72febb411b623b410.jpg)
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City Dresden / / / IndustryTerm microelectronic technologies / high tech / post-processing / energy / / Organization 3D Assembly / World Health Organization / / / Technology Process Control / X-Ray / CMP / / URL www.jobs.fraunhofer.de / www.izm.fraunhofer.de/assid / /
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