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Glass physics / Continuum mechanics / Semiconductor device fabrication / Mechanics / Fracture toughness / Fracture / Brittleness / Thermal oxidation / Microelectromechanical systems / Materials science / Chemistry / Physics


ECF15 STEADY-STATE MEASUREMENT OF THE INTERFACE FRACTURE RESISTANCE IN WAFER BONDING Y. Bertholet1,2, F. Iker1,3, X.X. Zhang1,3, J.P. Raskin1,3 and T. Pardoen1,2,* 1
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Document Date: 2009-10-23 06:25:17

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City

Wiley / /

Company

Cambridge University Press / /

Country

Belgium / /

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IndustryTerm

equilibrium solution / similar fracture energy / surface energy testing / electronics / chemical reaction occurring / fracture energy / chemical reaction / interface traction-separation law / energy dissipation / traction-separation law / energy / /

Organization

American Society for Testing and Materials / Cambridge University / Research Centre / /

Person

Gc / /

Position

representative / Dean / Corresponding author / /

ProvinceOrState

New York / /

PublishedMedium

la Recherche / /

Region

Levant / /

Technology

MEMS / simulation / Chemical Vapor Deposition / /

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