| Document Date: 2014-06-12 15:59:24
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City Halle / / Country Germany / France / / Facility Max Planck Institute of Microstructure Physics / Martin-Luther University / Semiconix Design Center / University of Bucharest / / IndustryTerm wafer bonding solutions / thin film layer transfer technologies / semiconductor technologies / layer stacking technologies / / Organization Semiconix Design Center in Bucharest / IEEE / Max Planck Institute of Microstructure Physics / University of Bucharest / / Person Ionut Radu / / Position group and project leader / staff scientist / keynote and invited speaker / member / / Technology semiconductor / semiconductor technologies / thin film layer transfer technologies / layer stacking technologies / /
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Ionut Radu SOITEC, Senior Expert - R&D, Bernin (France) Ionut Radu joined Soitec’s R&D organization in 2006 as staff scientist to develop wafer bonding solutions for advanced SOI substrates, such as sSOI, UTBOX and FD-