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Microtechnology / Semiconductor devices / Wafer / Dual in-line package / Light-emitting diode / Flip chip / Semiconductor device fabrication / Electronic engineering / Electronics


Datacon 2200 evoplus Innovative Solution for Innovative Products Future Proof Equipment The Datacon 2200 evopluss die bonder for Multi Module Attach
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Document Date: 2014-12-11 08:35:25

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File Size: 363,63 KB

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thermal compensation algorithm / mark search ÷÷ / /

MusicGroup

Pressure / /

Position

PLACE HEAD / Heated bond head / /

Technology

image processing / thermal compensation algorithm / 3 / 200 UPH/ ÷÷ Die Die size Flip chip / CAD / /

URL

www.besi.com / /

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