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Electronics manufacturing / Wafer bonding / Microelectromechanical systems / Anodic bonding / Eutectic bonding / Wafer / Adhesive bonding / Glass frit bonding / Direct bonding / Microtechnology / Technology / Electronics


SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µm
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Document Date: 2015-01-15 05:44:20

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File Size: 1,15 MB

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