SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µm

First Page		Document Content
Date: 2015-01-15 05:44:20 Electronics manufacturing Wafer bonding Microelectromechanical systems Anodic bonding Eutectic bonding Wafer Adhesive bonding Glass frit bonding Direct bonding Microtechnology Technology Electronics		SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µm Add to Reading List Source URL: www.enas.fraunhofer.de Download Document from Source Website File Size: 1,15 MB Share Document on Facebook

	Product Summary Guide Precision Power Analog It’s an exciting future for precision power analog! Apex Microtechnology is an industry leader for high-performance power DocID: 1v5qH - View Document
	Electronic Devices on Various Substrates: Fabrication of Releasable SingleCrystal SiliconMetal Oxide FieldEffect Devices and Their Deterministic Assembly on Foreign Substrates (Adv. Funct. Mater) DocID: 1rrrV - View Document
	Optimization of Electrode Configuration in Surface-Parallel Actuated Deformable Mirrors Marie Laslandesa , Sergio Pellegrinoa , John Steevesa , Keith Pattersonb a California Institute of Technology, 1200 E. California Bl DocID: 1rh2k - View Document
	Heat Load Experiments at CAMD and CLS D. Yemane1, S. Achenbach2, J. Goettert1, R. Guntaka3, D. Haluzan2, K. Nandakumar3, V. Singh1, V. Subramanian2, G. Wells2 1 LSU Center for Advanced Microstructures and Devices (CAMD), DocID: 1rdcU - View Document
	Microsoft Word - 03-YCai_MEMSIC_CStudy_jw6_dh1_20081023.doc DocID: 1r6kx - View Document