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Anodic bonding
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#	Item
1	SEMI-FINISHED BONDED SUBSTRATES CONSISTING OF PHOTOSENSITIVE FOTURAN® AND BOROFLOAT 33® Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-16 02:49:38 Electronics manufacturing Wafer bonding Wafer Anodic bonding Direct bonding Semiconductor device fabrication 100 micrometres 10 micrometres 1 micrometre Microtechnology Electronics Technology
2	SEMI-FINISHED BONDED SUBSTRATES CONSISTING OF LITHIUMTANTALATE AND SILICON Silicon Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 14:05:56 Electronics manufacturing Wafer bonding Semiconductor device fabrication Wafer Direct bonding Anodic bonding Microtechnology Electronics Technology
3	SEMI-FINISHED BONDED SUBSTRATES: SILICON ON GLASS (SOG) µm up. The precise specifications of each Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 06:53:22 Electronics manufacturing Wafer bonding Semiconductor device fabrication Wafer Chemical bonding Anodic bonding Direct bonding 100 micrometres Microelectromechanical systems Microtechnology Electronics Technology
4	THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 06:04:42 Technology Wafer bonding Thermocompression bonding Anodic bonding Direct bonding Chemical bond Reactive bonding Eutectic bonding Microtechnology Electronics Electronics manufacturing
5	SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µm Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 05:44:20 Electronics manufacturing Wafer bonding Microelectromechanical systems Anodic bonding Eutectic bonding Wafer Adhesive bonding Glass frit bonding Direct bonding Microtechnology Technology Electronics
6	6- Bonding LetiDay_ChDeguetfinal Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2014-07-18 03:18:39 Technology Wafer bonding Chemical bonding Semiconductor device fabrication Glass frit bonding Direct bonding Anodic bonding Wafer Microtechnology Electronics Electronics manufacturing