PRESS RELEASE 29 April 2015 ATV Technologie GmbH developing vacuum reflow soldering system with integrated apparatus for thermocompression bonding in cooperation with TU Berlin Part of the focus will be on the technologi

Source URL: www.atv-tech.de

THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS Contact

Source URL: www.enas.fraunhofer.de

• Technology
• Wafer bonding
• Thermocompression bonding
• Anodic bonding
• Direct bonding
• Chemical bond
• Reactive bonding
• Eutectic bonding
• Microtechnology
• Electronics
• Electronics manufacturing