![Electronics manufacturing / Wafer bonding / Wafer / Anodic bonding / Direct bonding / Semiconductor device fabrication / 100 micrometres / 10 micrometres / 1 micrometre / Microtechnology / Electronics / Technology Electronics manufacturing / Wafer bonding / Wafer / Anodic bonding / Direct bonding / Semiconductor device fabrication / 100 micrometres / 10 micrometres / 1 micrometre / Microtechnology / Electronics / Technology](https://www.pdfsearch.io/img/f37d591efb9d2d76fe3fee7f9bd773af.jpg)
| Document Date: 2015-01-16 02:49:38 Open Document File Size: 178,32 KBShare Result on Facebook
Country Germany / / / Facility Contact Materials Fraunhofer Institute / / IndustryTerm wet chemical etching / / Organization SEMI / Materials Fraunhofer Institute for Electronic Fraunhofer ENAS / / Person Dirk Wuensch / Maik Wiemer / / / Technology Dielectric / /
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