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Electronics manufacturing / Wafer bonding / Wafer / Anodic bonding / Direct bonding / Semiconductor device fabrication / 100 micrometres / 10 micrometres / 1 micrometre / Microtechnology / Electronics / Technology


SEMI-FINISHED BONDED SUBSTRATES CONSISTING OF PHOTOSENSITIVE FOTURAN® AND BOROFLOAT 33® Contact
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Document Date: 2015-01-16 02:49:38

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File Size: 178,32 KB

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Country

Germany / /

/

Facility

Contact Materials Fraunhofer Institute / /

IndustryTerm

wet chemical etching / /

Organization

SEMI / Materials Fraunhofer Institute for Electronic Fraunhofer ENAS / /

Person

Dirk Wuensch / Maik Wiemer / /

/

Technology

Dielectric / /

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