![Electronics manufacturing / Wafer bonding / Semiconductor device fabrication / Wafer / Direct bonding / Anodic bonding / Microtechnology / Electronics / Technology Electronics manufacturing / Wafer bonding / Semiconductor device fabrication / Wafer / Direct bonding / Anodic bonding / Microtechnology / Electronics / Technology](https://www.pdfsearch.io/img/d879e3f3ad146cdc71589b58c9923f79.jpg)
| Document Date: 2015-01-15 14:05:56 Open Document File Size: 840,08 KBShare Result on Facebook
/ Facility Contact Materials Fraunhofer Institute / / Organization SEMI / Contact Materials Fraunhofer Institute for Electronic Fraunhofer ENAS / / Person SEMI-FINISHED BONDED SUBSTRATES CONSISTING / Dirk Wuensch / Maik Wiemer / / / Technology Dielectric / /
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