SEMI-FINISHED BONDED SUBSTRATES: SILICON ON GLASS (SOG) µm up. The precise specifications of each Contact - Anodic bonding - Document - PDFSEARCH.IO

First Page	Meta Content
	SEMI-FINISHED BONDED SUBSTRATES: SILICON ON GLASS (SOG) µm up. The precise specifications of each Contact Add to Reading List Document Date: 2015-01-15 06:53:22 Open Document File Size: 164,09 KB Share Result on Facebook Country Germany / / / Facility Fraunhofer Institute / / IndustryTerm wet chemical etching / / Organization SEMI / Fraunhofer Institute for Electronic Silicon / / Person SEMI-FINISHED BONDED SUBSTRATES / / / Technology Dielectric / / SocialTag Electronics manufacturing Wafer bonding Semiconductor device fabrication Wafer Chemical bonding Anodic bonding Direct bonding 100 micrometres Microelectromechanical systems Microtechnology

SEMI-FINISHED BONDED SUBSTRATES: SILICON ON GLASS (SOG) µm up. The precise specifications of each ContactAdd to Reading List