Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages

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Date: 2013-03-04 05:56:59 Manufacturing Reflow soldering Surface-mount technology Rework Solder Thermal profiling Printed circuit board Flip chip Desoldering Electronics manufacturing Electronics Electronic engineering		Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages Add to Reading List Source URL: www.xilinx.com Download Document from Source Website File Size: 278,97 KB Share Document on Facebook

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