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Manufacturing / Reflow soldering / Surface-mount technology / Rework / Solder / Thermal profiling / Printed circuit board / Flip chip / Desoldering / Electronics manufacturing / Electronics / Electronic engineering


Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages
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Document Date: 2013-03-04 05:56:59


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File Size: 278,97 KB

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Company

Xilinx Inc. / Precision PCB Services Inc / Samina Corporation / McGraw-Hill Co. / /

IndustryTerm

thermal solutions / screen printing / metal wire / solvents/ chemicals / screen printing process / equipment manufacturer / performance products / flip-chip / prepared pre-tinned site / exposed metal heatsink / land metal / metal blade / metal pads / chemicals / automatic hot gas / priced devices / corrosive chemicals / /

Position

Major / tool head / /

Product

C-145 / /

ProgrammingLanguage

R / /

Technology

Alpha / FPGA / Laser / condensation / board design / Assembling Flip-Chip / performance flip-chip / Pb-free flip-chip / /

URL

http /

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