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B-Ration
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#	Item
11	USARIEM TECHNICAL NOTE TNNUTRITION FOR HEALTH AND PERFORMANCE, 2001 Nutritional Guidance for Military Operations in Temperate and Extreme Environments Add to Reading List Source URL: www.operationalmedicine.org Language: English - Date: 2008-12-03 09:11:06 Applied sciences Food science Health sciences Self-care United States Army Research Institute of Environmental Medicine Center for Nutrition Policy and Promotion Meal Ready-to-Eat Dietary Reference Intake B-Ration Health Food and drink Nutrition
12	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 17:47:15 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
13	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 03:08:02 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
14	F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Electronic Packaging & System Integration Invisible – Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 05:52:04 Technology Wafer bonding Integrated circuit packaging Reliability Flip chip Wafer Etching EV Group Three-dimensional integrated circuit Semiconductor device fabrication Microtechnology Electronics
15	21. Dezember 2011 \| www.hwwi.org \| Standpunkt AUTO R I N AR B E ITSM IG RATION Add to Reading List Source URL: www.hwwi.org Language: German - Date: 2011-12-21 06:04:05
16	Microsoft Word - Documentation for SpreadsheetK B & BJH edits ACCEPTED.doc Add to Reading List Source URL: cdp.wisc.edu Language: English - Date: 2010-03-01 17:54:20 Technology Cattle Dairy farming Industrial agriculture Total Mixed Ration Tractor Loader Truck Mixer-wagon Engineering vehicles Agricultural machinery Agriculture
17	F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Department System Integration and Interconnection Technologies Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-25 21:27:51 Semiconductor device fabrication Integrated circuits Semiconductor devices Electrical engineering Integrated circuit packaging Three-dimensional integrated circuit Integrated circuit System in package Microelectromechanical systems Technology Electromagnetism Electronics
18	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-13 17:05:57 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
19	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-02 11:52:26 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
20	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-01 11:41:42 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology