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![]() | Document Date: 2003-02-27 06:00:26Open Document Share Result on FacebookCityWarwick / /CompanyAlpha Metals / IBM / General Electric / Marley / Tessera / Texas Instruments / 3M Co. / Intel / ITT / /ContinentAsia / /CountryJapan / United States / /CurrencyUSD / /EventPatent Filing / M&A / /IndustryTermcircuit chip carrier / ceramic chip carrier makers / ceramic chip carrier / assembly infrastructure / technology show copper thickness / tape carrier package / drive technology / flex-based chip carrier disclosures / electronics / chip carrier needs / chip carrier / cantilevered metal beam leads / adequate flip chip / now-so-obvious solution / flex-based chip carrier / chip carrier technologies / /OrganizationCircuit Assembly / /PersonKen Gilleo / Jerry Murray / Frances Hugle / /Positiontechnical director / prolific author / West Coast Editor / /ProvinceOrStateRhode Island / /Technologysemiconductor / drive technology / semiconductors / dielectric / competing chip carrier technologies / high I/O chips / adequate flip chip / Integrated Circuit / /SocialTag |