Tape-automated bonding

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1	PDF Document Add to Reading List Source URL: material.htlwien10.at Language: English - Date: 2001-07-05 08:47:30 Technology Ball grid array Surface-mount technology Flip chip Tape-automated bonding Integrated circuit Chip scale package Wire bonding Multi-chip module Electronics manufacturing Electronics Electronic engineering
2	PDF Document Add to Reading List Source URL: eestud.kku.ac.th Language: English - Date: 2003-02-27 06:00:26 Technology Ball grid array Surface-mount technology Flip chip Tape-automated bonding Integrated circuit Chip scale package Wire bonding Multi-chip module Electronics manufacturing Electronics Electronic engineering