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Technology / Ball grid array / Surface-mount technology / Flip chip / Tape-automated bonding / Integrated circuit / Chip scale package / Wire bonding / Multi-chip module / Electronics manufacturing / Electronics / Electronic engineering


Document Date: 2001-07-05 08:47:30

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City

Warwick / /

Company

Alpha Metals / IBM / General Electric / Marley / Tessera / Texas Instruments / 3M Co. / Intel / ITT / /

Continent

Asia / /

Country

Japan / United States / /

Currency

USD / /

Event

Patent Filing / M&A / /

IndustryTerm

circuit chip carrier / ceramic chip carrier makers / ceramic chip carrier / assembly infrastructure / technology show copper thickness / tape carrier package / drive technology / flex-based chip carrier disclosures / electronics / chip carrier needs / chip carrier / cantilevered metal beam leads / adequate flip chip / now-so-obvious solution / flex-based chip carrier / chip carrier technologies / /

Organization

Circuit Assembly / /

Person

Ken Gilleo / Jerry Murray / Frances Hugle / /

Position

technical director / prolific author / West Coast Editor / /

ProvinceOrState

Rhode Island / /

Technology

semiconductor / drive technology / semiconductors / dielectric / competing chip carrier technologies / high I/O chips / adequate flip chip / Integrated Circuit / /

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