![Semiconductor device fabrication / Microtechnology / Etching / Plasma processing / Chemical milling / Isotropic etching / Plasma etching / Microelectromechanical systems / Buffered oxide etch Semiconductor device fabrication / Microtechnology / Etching / Plasma processing / Chemical milling / Isotropic etching / Plasma etching / Microelectromechanical systems / Buffered oxide etch](https://www.pdfsearch.io/img/7bc7436d640a11aad966c4f2c4fe715d.jpg) Date: 2016-04-25 13:15:12Semiconductor device fabrication Microtechnology Etching Plasma processing Chemical milling Isotropic etching Plasma etching Microelectromechanical systems Buffered oxide etch | | High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECSAdd to Reading ListSource URL: web.eecs.umich.eduDownload Document from Source Website File Size: 260,37 KBShare Document on Facebook
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