High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS

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Date: 2016-04-25 13:15:12 Semiconductor device fabrication Microtechnology Etching Plasma processing Chemical milling Isotropic etching Plasma etching Microelectromechanical systems Buffered oxide etch		High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS Add to Reading List Source URL: web.eecs.umich.edu Download Document from Source Website File Size: 260,37 KB Share Document on Facebook

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	High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS DocID: 1p1ER - View Document