Back to Results
First PageMeta Content
Electronics manufacturing / Wafer bonding / Microelectromechanical systems / Anodic bonding / Eutectic bonding / Wafer / Adhesive bonding / Glass frit bonding / Direct bonding / Microtechnology / Technology / Electronics


SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µm
Add to Reading List

Document Date: 2015-01-15 05:44:20

Open Document

File Size: 1,15 MB

Share Result on Facebook

Country

Germany / /

/

Facility

Disco Dag / Subsequently Contact Description Fraunhofer Institute / /

IndustryTerm

wafer bonding technologies / manufacturing / customer-specific solutions / /

Organization

Contact Description Fraunhofer Institute for Electronic Semi-finished / SEMI / /

Person

SEMI-FINISHED BONDED SUBSTRATES / Maik Wiemer / /

/

Technology

CVD / MEMS / tal Furnace Technologies / ECD wafer bonding technologies / CMP / /

SocialTag