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Electronics manufacturing / Wafer bonding / Semiconductor device fabrication / Wafer / Direct bonding / Pyroelectricity / Microtechnology / Technology / Electronics
Date: 2015-01-16 02:26:59
Electronics manufacturing
Wafer bonding
Semiconductor device fabrication
Wafer
Direct bonding
Pyroelectricity
Microtechnology
Technology
Electronics

SEMI-FINISHED BONDED SUBSTRATES CONSISTING OF PIEZO- AND PYROELECTRIC LITHIUMTANTALAT AND GLASS Materials

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Source URL: www.enas.fraunhofer.de

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