camera devices / micro camera devices / final carrier / pixel detector applications / interposer technologies / thin-film processing / energy particle detection / impedance-measuring tool / manufacturing costs / solder printing / microelectronic products / smart solutions / Sensor chips / negative technology / lithographical printing / pre-deposited metal structures / physical and chemical properties / technology branches / metal layers / electronic systems / de-bonding equipment / input device / manufacturing miniature / flip chip mounting search / polymer devices / industrial applications / chemical industry / transponder chips / readout chips / flip-chip / backside processing / passives devices / mm readout chip systems / bonded carrier wafers / Production-compatible equipment / electronics / 3D systems / process chain / energy systems / technology using electroplating / energy efficiency / metal-insulator-metal capacitors / manufacturing / metal alloys / electronic readout chip / carrier wafers / fewer processing steps / assistance systems / technology transfer / backside processing glass material / /
Organization
Fraunhofer Institute for Reliability and Microintegration / DEPARTMENT OF High Density Interconnect & Wafer Level Packaging High Density Interconnect / CSP Center for Microperipheric Technologies / /
Person
Volker Mai / Klaus-Dieter Lang / Pixel / Lothar Dietrich / Gunter Engelmann / Martin Wilke / Thomas Fritzsch / Michael Töpper / Veronika Glaw / / /
F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging