1![Failure Modes of Tearing and a Novel Robust Approach Ali Baharev Arnold Neumaier Hermann Schichl Faculty of Mathematics, University of Vienna, Oskar-Morgenstern-Platz 1, 1090 Vienna, Austria Failure Modes of Tearing and a Novel Robust Approach Ali Baharev Arnold Neumaier Hermann Schichl Faculty of Mathematics, University of Vienna, Oskar-Morgenstern-Platz 1, 1090 Vienna, Austria](https://www.pdfsearch.io/img/171733c3291ebb5bf97658829fbf7c30.jpg) | Add to Reading ListSource URL: reliablecomputing.euLanguage: English - Date: 2017-08-25 09:01:41
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2![Failure Modes of Tearing and a Novel Robust Approach Ali Baharev Arnold Neumaier Hermann Schichl Faculty of Mathematics, University of Vienna, Oskar-Morgenstern-Platz 1, 1090 Vienna, Austria Failure Modes of Tearing and a Novel Robust Approach Ali Baharev Arnold Neumaier Hermann Schichl Faculty of Mathematics, University of Vienna, Oskar-Morgenstern-Platz 1, 1090 Vienna, Austria](https://www.pdfsearch.io/img/f420ca1c4ae7687d4472bf1486566977.jpg) | Add to Reading ListSource URL: www.mat.univie.ac.atLanguage: English - Date: 2017-05-24 03:09:16
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3![Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging With Correlative Analysis Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging With Correlative Analysis Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street](https://www.pdfsearch.io/img/c63387da424ef40398aba323a0fba82e.jpg) | Add to Reading ListSource URL: www.sonoscan.com- Date: 2016-07-20 11:09:32
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4![Vibration Control Type 663 * Velocity (mm/s, rms) Vibration Control Type 663 * Velocity (mm/s, rms)](https://www.pdfsearch.io/img/6a12b10c0e3b4a501c432a2ae01b3223.jpg) | Add to Reading ListSource URL: www.hauber-elektronik.deLanguage: English - Date: 2016-02-03 10:10:41
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5![CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A. CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A.](https://www.pdfsearch.io/img/531f7feabc9f586b54c0696a08310375.jpg) | Add to Reading ListSource URL: www.sonoscan.comLanguage: English - Date: 2016-07-20 11:09:32
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6![Safety Manual SIL3 Vibration Control Type 663 Standard Safety Manual SIL3 Vibration Control Type 663 Standard](https://www.pdfsearch.io/img/4894b8f100325ec0d5788f523eeb961b.jpg) | Add to Reading ListSource URL: www.hauber-elektronik.deLanguage: English - Date: 2015-05-22 04:30:34
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7![Towards Transparent Systems: Semantic Characterization of Failure Modes Aayush Bansal1 , Ali Farhadi2 , and Devi Parikh3 1 1 Towards Transparent Systems: Semantic Characterization of Failure Modes Aayush Bansal1 , Ali Farhadi2 , and Devi Parikh3 1 1](https://www.pdfsearch.io/img/74d04fcbd23fa0377804e55b416b234a.jpg) | Add to Reading ListSource URL: vision.cs.utexas.eduLanguage: English - Date: 2014-08-07 21:20:30
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8![Towards Transparent Systems: Semantic Characterization of Failure Modes Aayush Bansal1 , Ali Farhadi2 , and Devi Parikh3 1 Carnegie Mellon University Towards Transparent Systems: Semantic Characterization of Failure Modes Aayush Bansal1 , Ali Farhadi2 , and Devi Parikh3 1 Carnegie Mellon University](https://www.pdfsearch.io/img/1e453c55eb25e91d6e269bfb0306315e.jpg) | Add to Reading ListSource URL: vision.cs.utexas.eduLanguage: English - Date: 2014-08-07 21:21:38
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9![Standard for Performing a Failure Modes and Effects Analysis Standard for Performing a Failure Modes and Effects Analysis](https://www.pdfsearch.io/img/f6f6f18b07fbd313d584a17b3bbcdd29.jpg) | Add to Reading ListSource URL: rsdo.gsfc.nasa.govLanguage: English - Date: 2009-06-17 11:40:02
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10![SISPAD 2012, September 5-7, 2012, Denver, CO, USA TCAD Study of Electromigration Failure Modes in Sn-Based Solder Bumps H. Cerica,b, R. L. de Oriob, and S. Selberherrb a SISPAD 2012, September 5-7, 2012, Denver, CO, USA TCAD Study of Electromigration Failure Modes in Sn-Based Solder Bumps H. Cerica,b, R. L. de Oriob, and S. Selberherrb a](https://www.pdfsearch.io/img/1dc8c947af0929d25452bc2e9d94b018.jpg) | Add to Reading ListSource URL: in4.iue.tuwien.ac.atLanguage: English - Date: 2013-02-12 08:39:10
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