Failure modes of electronics
Results: 3
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1 | CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A.Add to Reading ListSource URL: www.sonoscan.comLanguage: English - Date: 2016-07-20 11:09:32 |
2![April[removed]Flex Crack Mitigation by Bill Sloka, Ceramic Technical Consultant As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing](https://www.pdfsearch.io/img/8b26e82dbde7cd9f2b0596ff420ab367.jpg "April[removed]Flex Crack Mitigation by Bill Sloka, Ceramic Technical Consultant As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing") | April[removed]Flex Crack Mitigation by Bill Sloka, Ceramic Technical Consultant As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturingAdd to Reading ListSource URL: www.kemet.comLanguage: English - Date: 2014-03-17 16:58:08 |
3 | PDF DocumentAdd to Reading ListSource URL: www.ifte.deLanguage: English - Date: 2006-04-19 03:35:04 |