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Electronics / Mechanical engineering / Electronic design automation / Heat sink / Simulation software / Thermal management of electronic devices and systems / Flip chip / Integrated circuit / Thermal copper pillar bump / Electronic engineering / Passive fire protection / Heat transfer


Simulation Cuts IC Cost 20% by Comparing Flip Chip/Wirebond Thermal Performance
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Document Date: 2013-06-21 14:24:23

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File Size: 140,47 KB

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Company

Applied Micro Circuits Corporation / Flomerics / /

IndustryTerm

thermal simulation software / metal / distributed processing / blade server / telecom line card applications / flip-chip / Web browser / similar products / performance chip / thermal management / metal layers / electronic cooling applications / complicated electronics / /

Person

Neal Neslusan / Mark Patterson / /

Position

Packaging Engineer / model / Director of Marketing / /

Product

Flopack / Flotherm / Flotherm thermal simulation software / /

Technology

Ethernet / performance chip / Gigabit / Simulation / Comparing flip-chip / integrated circuit / Reducing chip / Gigabit Ethernet / /

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