![Electronics / Mechanical engineering / Electronic design automation / Heat sink / Simulation software / Thermal management of electronic devices and systems / Flip chip / Integrated circuit / Thermal copper pillar bump / Electronic engineering / Passive fire protection / Heat transfer Electronics / Mechanical engineering / Electronic design automation / Heat sink / Simulation software / Thermal management of electronic devices and systems / Flip chip / Integrated circuit / Thermal copper pillar bump / Electronic engineering / Passive fire protection / Heat transfer](https://www.pdfsearch.io/img/ebf2e2d4e0f899c39f5c2040af2ed8ec.jpg)
| Document Date: 2013-06-21 14:24:23 Open Document File Size: 140,47 KBShare Result on Facebook
Company Applied Micro Circuits Corporation / Flomerics / / IndustryTerm thermal simulation software / metal / distributed processing / blade server / telecom line card applications / flip-chip / Web browser / similar products / performance chip / thermal management / metal layers / electronic cooling applications / complicated electronics / / Person Neal Neslusan / Mark Patterson / / Position Packaging Engineer / model / Director of Marketing / / Product Flopack / Flotherm / Flotherm thermal simulation software / / Technology Ethernet / performance chip / Gigabit / Simulation / Comparing flip-chip / integrated circuit / Reducing chip / Gigabit Ethernet / /
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