![Semiconductor device fabrication / Electrical engineering / Mechanical engineering / Microelectromechanical systems / Transducers / Wafer bonding / Flip chip / Deep reactive-ion etching / Amkor Technology / Materials science / Technology / Microtechnology Semiconductor device fabrication / Electrical engineering / Mechanical engineering / Microelectromechanical systems / Transducers / Wafer bonding / Flip chip / Deep reactive-ion etching / Amkor Technology / Materials science / Technology / Microtechnology](https://www.pdfsearch.io/img/589d2d9dec84ca83f1bca7700fcfa9e7.jpg) Date: 2014-01-22 10:45:23Semiconductor device fabrication Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Wafer bonding Flip chip Deep reactive-ion etching Amkor Technology Materials science Technology Microtechnology | | High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market Russell Shumway Director- MEMS & Sensor Products Office: Add to Reading ListSource URL: www.gsaglobal.orgDownload Document from Source Website File Size: 1,28 MBShare Document on Facebook
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