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Integrated Micro-Electronics
Results: 35

#	Item
1	CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A. Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Microscopy Electronics manufacturing Manufacturing Economy Business Acoustic microscopy Flip chip Solder Reliability Integrated circuit Bump Microscope
2	CSP and micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (AMI) Steven R. Martell and J.E. Semmens SONOSCAN IncE. Pratt Blvd. Elk Grove Village, IL 60007 Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Electronic engineering Electrical engineering Electromagnetism Semiconductor device fabrication Packaging Electronics manufacturing Ball grid array Surface-mount technology Solder Reflow soldering Integrated circuit packaging Reliability
3	Let’s innovate sustainable solutions. solutions 2014 Sustainability Report Add to Reading List Source URL: www.ayala.com.ph Language: English - Date: 2015-10-27 03:23:55 Environmental economics Integrated Micro-Electronics Inc. Sustainability Sustainable development Corporate social responsibility Electronic waste Waste
4	OWNERSHIP STRUCTURE Integrated Micro-Electronics, Inc. As of December 31, 2015 (per GIS) Name AYC Holdings, Ltd. Add to Reading List Source URL: www.global-imi.com - Date: 2016-06-02 06:43:55
5	�� September 2004 �� Add to Reading List Source URL: www.plasmachem.com Language: English - Date: 2010-04-07 05:42:00 Adlershof Wafer Advanced Micro Devices Saint-Gobain Integrated circuit Electronics manufacturing Technology Siltronic Microtechnology
6	Bottom-up construction of in vitro switchable memories Adrien Padirac, Teruo Fujii, and Yannick Rondelez1 Laboratory for Integrated Micro-Mechatronic Systems, Centre National de la Recherche Scientiﬁque/Institute of In Add to Reading List Source URL: www.dna.caltech.edu Language: English - Date: 2014-01-29 15:05:39 Electronics Ultrasensitivity Bistability Positive feedback Bistable Flip-flop Regulation of gene expression Digital electronics Biology Electronic engineering
7	PDF Document Add to Reading List Source URL: archive.computerhistory.org Language: English - Date: 2009-07-13 12:01:26 Electronics Advanced Micro Devices Microprocessor Intel Integrated circuit Bit slicing 9 Reduced instruction set computing Computer hardware Electronic engineering Digital electronics
8	AMD 22V10 PAL Oral History Panel; Add to Reading List Source URL: archive.computerhistory.org Language: English - Date: 2013-03-11 18:46:19 Programmable Array Logic Monolithic Memories Programmable logic device Advanced Micro Devices PALASM Microprocessor Logic gate Integrated circuit Digital electronics Electronic engineering Electronic design automation Fabless semiconductor companies
9	Advanced Technology Option Micro-via Technology Within the powerful Pulsonix environment, advanced Micro-via technologies are easily created for everyday design engineers. Constraint Rules Driven Add to Reading List Source URL: www.pulsonix.com Language: English - Date: 2013-08-20 05:26:18 Electromagnetism Electronic design Via Printed circuit board PCB Surface-mount technology Design rule checking Three-dimensional integrated circuit Quad-flat no-leads package Electronic engineering Electronics manufacturing Electronics
10	High Power GaN Solutions for Next Generation Radar David Aichele Director, RFMD Power Business Unit EuMW October 2012 Add to Reading List Source URL: www.rfmd.com Language: English - Date: 2014-11-11 06:29:26 Semiconductor device fabrication Compound semiconductors Inorganic compounds Electronic design Gallium nitride Nitrides Monolithic microwave integrated circuit RF Micro Devices Gallium arsenide Chemistry Technology Electronics

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