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Technology / Etching / Plasma processing / Microelectromechanical systems / Transducers / Dry etching / Isotropic etching / Plasma etching / Wafer / Semiconductor device fabrication / Microtechnology / Materials science


News Release Nanoplas Announces Important New 14nm Order and Joint Development Agreement with CEA-Leti High-selectivity dry-etch for 14nm OEM pilot line will replace wet etch; CEA-Leti to qualify the system for addition
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Document Date: 2013-11-27 09:43:38


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City

Tokyo / Silicon Valley / Grenoble / /

Company

CEA-Leti Plasma Etching & Stripping Laboratory / Nanoplas / CEA-Leti / /

Continent

Asia / North America / Europe / /

Country

France / /

/

Event

Business Partnership / /

IndustryTerm

plasma-processing tools / dry process solution / sub-20nm node applications / micro and nano solutions / 300mm wafer processing / transistor-formation technologies / plasma process solutions / plasma processing equipment / wet processing / equipment supplier / chemicals / beta site / 14nm manufacturing processes / /

Organization

Silicon Technology Division / /

Person

Laurent Malier / Gilles Baujon / Bruce Hokanson / /

/

Position

CEO / /

ProvinceOrState

California / /

Technology

semiconductor / MEMS / dielectric / transistor-formation technologies / /

URL

www.leti.fr / www.nanoplas.eu / /

SocialTag