MICROELECTRONICS ASSEMBLY Microelectronics Assembly With over four decades of experience in high reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembler. The m

First Page		Document Content
Date: 2016-01-20 13:47:56 Semiconductor device fabrication Solder Reliability Integrated circuit Welding Wire bonding Flip chip Ball grid array Flux		MICROELECTRONICS ASSEMBLY Microelectronics Assembly With over four decades of experience in high reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembler. The m Add to Reading List Source URL: www.neotech.com Download Document from Source Website File Size: 774,86 KB Share Document on Facebook

	MICROELECTRONICS ASSEMBLY Microelectronics Assembly With over four decades of experience in high reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembler. The m DocID: 1px4a - View Document
	RGSJBIST PRODUCT BRIEF E N G I N E E R I N G I N N O V A T I O N DocID: 1pcLh - View Document
	A4.7 (C. Koos/ N. Lindenmann) [A4.7:1] * N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, Photonic wire bonding: a novel concept for chip-scale interconnects, Opt. DocID: 1obss - View Document
	micronanofabricacion_centro_tecnologia_nanofotonica DocID: 1fEkh - View Document
	Design and Measurement of Matched Wire Bond and Flip Chip Interconnects for D-Band System-in-Package Applications S. Beer, B. Ripka, S. Diebold, H. Gulan, C. Rusch, P. Pahl, T. Zwick Institut fuer Hochfrequenztechnik und DocID: 1a4g1 - View Document