Market Trend with Packaging Technology

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Date: 2013-07-28 00:29:56 Integrated circuits Microtechnology Three-dimensional integrated circuit Ball grid array Quad-flat no-leads package Chip scale package Interposer Amkor Technology Flip chip Semiconductor device fabrication Electronics Electronic engineering		Market Trend with Packaging Technology Add to Reading List Source URL: www.hotchips.org Download Document from Source Website File Size: 3,29 MB Share Document on Facebook

	Electroless and electrolytic copper plating of glass interposer combined with metal oxide adhesion layer for manufacturing 3D RF devices Zhiming Liu, Hailuo Fu, Sara Hunegnaw, Jun Wang, Michael Merschky, Tafadzwa Magaya DocID: 1vqw7 - View Document
	NXQ4000 MASK ALIGNER Microelectronics LED/HB LED 3D IC WLP 2.5D Interposer DocID: 1mSbJ - View Document
	3D Packaging Synthetic Quartz Substrate and Interposer for High Frequency Applications DocID: 1kmD8 - View Document
	Paper Title 3D Si Interposer Design and Electrical Performance Study Authors Mandy (Ying) Ji DocID: 1a9tX - View Document
	Visio-2.5D Interposer_★.vsd DocID: 18IzZ - View Document