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Integrated circuits / Microtechnology / Three-dimensional integrated circuit / Ball grid array / Quad-flat no-leads package / Chip scale package / Interposer / Amkor Technology / Flip chip / Semiconductor device fabrication / Electronics / Electronic engineering


Market Trend with Packaging Technology
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Document Date: 2013-07-28 00:29:56

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File Size: 3,29 MB

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Company

Amkor / /

Facility

TSV Key Process Foundry / Stacking Tutorial Choon Lee Technology HQ / /

Organization

PoP TMV Hybrid TSV / /

Person

Ni / /

Product

Ultra book Tablet / /

PublishedMedium

The Guardian / /

Technology

Choon 3D Packaging Paradigm Shift Package Stacking 3D Stacking 3D IC Package-on-Package Flip chip / CVD / MEMS / Choon PC Technology / Mobile Phone Technology / Smartphones / Smartphone / CMP / /

URL

www.ifixit.com / /

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