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Quality management system / Electronics / Electronic engineering / Semiconductor device fabrication / Electronics manufacturing / Technology / Wafer-level packaging / Chip scale package / Flip chip / Quality assurance
Date: 2014-08-06 22:09:12
Quality management system
Electronics
Electronic engineering
Semiconductor device fabrication
Electronics manufacturing
Technology
Wafer-level packaging
Chip scale package
Flip chip
Quality assurance

FlipChip International: I MPLEMENTING TO SUPPORT GROWTH, OBTAIN REAL TIME COMMUNICATION AND RAPID PROBLEM SOLVING An AssurX interview with Sheila Mosher, VP of Information Technology Introduction

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