![Quality management system / Electronics / Electronic engineering / Semiconductor device fabrication / Electronics manufacturing / Technology / Wafer-level packaging / Chip scale package / Flip chip / Quality assurance Quality management system / Electronics / Electronic engineering / Semiconductor device fabrication / Electronics manufacturing / Technology / Wafer-level packaging / Chip scale package / Flip chip / Quality assurance](https://www.pdfsearch.io/img/e9fe880bf0182a720a0dfa69f902b161.jpg) Date: 2014-08-06 22:09:12Quality management system Electronics Electronic engineering Semiconductor device fabrication Electronics manufacturing Technology Wafer-level packaging Chip scale package Flip chip Quality assurance | | FlipChip International: I MPLEMENTING TO SUPPORT GROWTH, OBTAIN REAL TIME COMMUNICATION AND RAPID PROBLEM SOLVING An AssurX interview with Sheila Mosher, VP of Information Technology IntroductionAdd to Reading ListSource URL: www.assurx.comDownload Document from Source Website File Size: 72,78 KBShare Document on Facebook
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