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Quality management system / Electronics / Electronic engineering / Semiconductor device fabrication / Electronics manufacturing / Technology / Wafer-level packaging / Chip scale package / Flip chip / Quality assurance


FlipChip International: I MPLEMENTING TO SUPPORT GROWTH, OBTAIN REAL TIME COMMUNICATION AND RAPID PROBLEM SOLVING An AssurX interview with Sheila Mosher, VP of Information Technology Introduction
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Document Date: 2014-08-06 22:09:12

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File Size: 72,78 KB

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Company

FlipChip International / AssurX Inc. / /

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Facility

Phoenix Arizona facility / /

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IndustryTerm

real time / high volume manufacturing / potential products / turn-key wafer bumping services / /

Person

Sheila Mosher / Terrance Lubsen / Wafer Level / /

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Position

VP of Information Technology Introduction / Vice President of Quality / VP / /

Product

CATSWeb / /

Technology

semiconductor / Information Technology / /

URL

www.assurx.com / /

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